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Package Layout Design Staff/Senior Staff Engineer

Location: Bengaluru, Karnataka, India
Posted:
2 days
Mid-Senior Level
AI Infrastructure
Application Specific Semiconductors
Artificial Intelligence (AI)
Automation/Workflow Software
Business/Productivity Software
Data & Analytics
Data Center
Hardware
Machine Learning
Optical Communication
Other Hardware
Platform
Science and Engineering
Semiconductor Manufacturing
Semiconductors
Software
Technology
Vertical Market Software

Package Design, Signal and Power Integrity Senior Staff Engineer

Location: Santa Clara, CA, USA
Compensation:

USD 141,150-211,400 / year + Equity

Posted:
17 days
Senior
AI Infrastructure
Application Specific Semiconductors
Artificial Intelligence (AI)
Automation/Workflow Software
Business/Productivity Software
Data & Analytics
Data Center
Hardware
Machine Learning
Optical Communication
Other Hardware
Platform
Science and Engineering
Semiconductor Manufacturing
Semiconductors
Software
Technology
Vertical Market Software

Advanced Package Design Senior Staff Engineer

Location: Santa Clara, CA, USA
Compensation:

USD 141,150-211,400 / year + Equity

Posted:
23 days
Senior
AI Infrastructure
Application Specific Semiconductors
Artificial Intelligence (AI)
Automation/Workflow Software
Business/Productivity Software
Data & Analytics
Data Center
Hardware
Machine Learning
Optical Communication
Other Hardware
Platform
Science and Engineering
Semiconductor Manufacturing
Semiconductors
Software
Technology
Vertical Market Software

Package Design Quality Assurance Engineer

Location: Burlington, VT, USA
Posted:
2 months
Mid-Senior Level
AI Infrastructure
Application Specific Semiconductors
Artificial Intelligence (AI)
Automation/Workflow Software
Business/Productivity Software
Data & Analytics
Data Center
Hardware
Machine Learning
Optical Communication
Other Hardware
Platform
Science and Engineering
Semiconductor Manufacturing
Semiconductors
Software
Technology
Vertical Market Software

Advanced Packaging Design - SI/PI Engineer

Location: Chandler, AZ, USA; Westborough, MA, USA
Compensation:

USD 134,400-198,910 / year + Equity

Posted:
1 day
Mid-Senior Level
AI Infrastructure
Application Specific Semiconductors
Artificial Intelligence (AI)
Automation/Workflow Software
Business/Productivity Software
Data & Analytics
Data Center
Hardware
Machine Learning
Optical Communication
Other Hardware
Platform
Science and Engineering
Semiconductor Manufacturing
Semiconductors
Software
Technology
Vertical Market Software

Principal Advanced Packaging Design Engineer

Location: Burlington, VT, USA
Compensation:

USD 168,400-249,310 / year + Equity

Posted:
1 month
Senior
AI Infrastructure
Application Specific Semiconductors
Artificial Intelligence (AI)
Automation/Workflow Software
Business/Productivity Software
Data & Analytics
Data Center
Hardware
Machine Learning
Optical Communication
Other Hardware
Platform
Science and Engineering
Semiconductor Manufacturing
Semiconductors
Software
Technology
Vertical Market Software